label.m M-Plex Bond Repairing Shampoo, 300 ml
0/5 0 atsauksmes
Preces kods:
082495
Pieejamība:
Pieejams
Pieejams
Cena:
22,99€
| Daudzums | Cena | Atlaide |
| 2-5 | 22,07€ | 4% |
| 5-10 | 21,38€ | 7% |
| 10+ | 20,69€ | 10% |
| * Lielākiem daudzumiem tiek piemērotas atlaides. Atlaides nav kumulatīvas un nav spēkā precēm, kurām ir atlaide vai piedalās citās akcijās. | ||
Bezmaksas piegāde, pērkot preces par 100 EUR vai vairāk. Mēs piegādāsim šo produktu 4-6 darba dienu laikā. Plašāku informāciju par piegādes metodēm skatiet šeit.
Iesakām iegādāties kopā:
Introducing Label.m M-Plex Bond Repairing Shampoo 300ml, a rejuvenating cleanser that repairs and fortifies your hair, leaving it stronger, more resilient, and beautifully cleansed.
• Hair Repair: Restores and strengthens damaged hair.
• Enhanced Resilience: Improves hair's overall health and durability.
• Deep Cleansing: Gently removes impurities while maintaining hair's natural moisture.
Ingredients:
Aqua (Water/Eau), Sodium C14-16 Olefin Sulfonate, Cocamidopropyl Hydroxysultaine, Decyl Glucoside, Cocamide MIPA, Glycol Distearate, Fragrance/Parfum, Methyl Gluceth-20, Sodium Cocoyl Glutamate, Bis-PCA Dimethicone, Disodium PEG-12 Dimethicone Sulfosuccinate, Hydrolyzed Adansonia Digitata (Baobab) Extract, Hydrolyzed Linseed Seed, Aloe Barbadensis Leaf Juice, Camellia Sinensis Leaf (Green Tea) Extract, Aspalathus Linearis Leaf (Rooibos) Extract, Cocos Nucifera (Coconut) Liquid Endosperm, Lycium Barbarum (Goji) Fruit Extract, Olea Europaea (Olive) Fruit Oil, Crambe Abyssinica (Abyssinian) Seed Oil, Divinyldimethicone/Dimethicone Copolymer, C12-13 Pareth-23, C12-13 Pareth-3, Amodimethicone, C11-15 Pareth-7, Laureth-9, Sodium Chloride, Trideceth-12, PEG-150 Pentaerythrityl Tetrastearate, Tocopheryl Acetate, Biotin, Panthenol, Phenoxyethanol, Maltodextrin, Guar Hydroxypropyltrimonium Chloride, Glycerin, Olea Europaea (Olive) Fruit Extract, Malpighia Glabra (Acerola) Fruit Extract, Persea Gratissima (Avocado) Oil, Polysilicone-15, Helianthus Annuus (Sunflower) Seed Extract, Salvia Hispanica (Chia) Seed Extract, Saccharomyces Cerevisiae (Brewer's Yeast) Extract, Leuconostoc/Radish Root Ferment Filtrate, Guar Hydroxypropyltrimonium Chloride, Butylene Glycol, Aminomethyl Propanol, Acrylates Copolymer, Benzyl Alcohol, Benzoic Acid, Tetrasodium EDTA, Potassium Sorbate, Sodium Benzoate, Linalool, Benzyl Benzoate, Limonene, Iodopropynyl Butylcarbamate, Citric Acid.
How to use:Apply to wet hair, massage gently and rinse. Use with M-Plex Bond Repairing Conditioner for best results.
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